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BGAH170-075E I-Tech Specifications

BGA HEATSINK W/TAPE

Isibaluli Somkhiqizo Isibaluli senani
Category BGAH170-075E
Manufacturer Ohmite
Factory Lead Time 3 Weeks
Factory Lead Time 18 Weeks
Shape Square, Angled Fins
Material Finish Black Anodized
Part Status Active
Type Top Mount
Height Off Base (Height of Fin) 0.295 7.50mm
Length 0.669 17.00mm
RoHS Status ROHS3 Compliant
Isibaluli Somkhiqizo Isibaluli senani
Part Status Active
RoHS Status ROHS3 Compliant
Pbfree Code yes
Material Aluminum Alloy
Package Cooled BGA, CPU, GPU
Series BG
Moisture Sensitivity Level (MSL) Not Applicable
Attachment Method Thermal Tape, Adhesive (Included)
Thermal Resistance @ Natural 17.10°C/W
Width 0.669 17.00mm
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BGAH1A10E6327XTSA1 Infineon Technologies RF Amplifiers

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BGAH170-075E abakhiqizi bomkhiqizo: Ohmite, Bonchip isitoko, BGAH170-075E intengo yereferensi. BGAH170-075E imingcele, BGAH170-075E I-Datasheet PDF kanye nephinikhodi yencazelo yomdwebo wokulanda.Ungasebenzisa i BGAH170-075E Izixhumi ezixhumekayo, i-DSP Datesheet PDF, thola BGAH170-075E umdwebo wephini kanye nomdwebo wesifunda kanye nendlela yokusebenzisa umsebenzi, BGAH170-075E electronics tutorials.Ungalanda kusukela ku Bonchip.
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