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72V211L15PF I-Tech Specifications

72V211L15PF datasheet pdf and Logic - FIFOs Memory product details from Integrated Device Technology (IDT) stock available at Bonchip

Isibaluli Somkhiqizo Isibaluli senani
Category Integrated Circuits (ICs) / FIFOs Memory
Manufacturer Integrated Device Technology (IDT)
Factory Lead Time 3 Weeks
Factory Lead Time 7 Weeks
Mount Surface Mount
Number of Pins 32
JESD-609 Code e0
Part Status Active
Number of Terminations 32
Terminal Finish Tin/Lead (Sn85Pb15)
Min Operating Temperature 0°C
Technology CMOS
Terminal Form GULL WING
Number of Functions 1
Terminal Pitch 0.8mm
Pin Count 32
Temperature Grade COMMERCIAL
Min Supply Voltage 3V
Nominal Supply Current 20mA
Frequency (Max) 66.7MHz
Organization 512X9
Standby Current-Max 0.005A
Sync/Async Synchronous
Memory IC Type OTHER FIFO
FWFT Support No
Output Enable YES
Height Seated (Max) 1.6mm
Width 7mm
RoHS Status RoHS Compliant
Isibaluli Somkhiqizo Isibaluli senani
Part Status Active
RoHS Status ROHS3 Compliant
Pbfree Code yes
Contact Plating Lead, Tin
Package / Case TQFP
Published 2008
Pbfree Code no
Moisture Sensitivity Level (MSL) 3
ECCN Code EAR99
Max Operating Temperature 70°C
Subcategory FIFOs
Terminal Position QUAD
Peak Reflow Temperature (Cel) 240
Supply Voltage 3.3V
Frequency 66.7MHz
Operating Supply Voltage 3.3V
Max Supply Voltage 3.6V
Element Configuration Dual
Max Supply Current 20mA
Access Time 10 ns
Density 4.5 kb
Parallel/Serial PARALLEL
Word Size 9b
Bus Directional Unidirectional
Programmable Flags Support Yes
Cycle Time 15 ns
Length 7mm
Thickness 1.4mm
Lead Free Contains Lead
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72V211L15PF abakhiqizi bomkhiqizo: Integrated Device Technology (IDT) , Bonchip isitoko, 72V211L15PF intengo yereferensi. 72V211L15PF imingcele, 72V211L15PF I-Datasheet PDF kanye nephinikhodi yencazelo yomdwebo wokulanda.Ungasebenzisa i 72V211L15PF Izixhumi ezixhumekayo, i-DSP Datesheet PDF, thola 72V211L15PF umdwebo wephini kanye nomdwebo wesifunda kanye nendlela yokusebenzisa umsebenzi, 72V211L15PF electronics tutorials.Ungalanda kusukela ku Bonchip.
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